JingHong Device
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| Processor Specifications | CPU Terrace: | Intel 8 / 9 / 10 45W CPU Intel Alder Lake-H 12th gen CPU Intel Raptor Lake-H 13th gen CPU |
Internal Storage | Memory Type: | DDR4: 2133MHz / 2400MHz / 2666MHz / 3200MHz |
| CPU Model: | i7-10750H / i9-9880H / i7-9750H / i7-8750H etc. Intel i7-12700H, i9-12900H, 13900H, etc. |
Memory Slot: | 2×DDR4 SO-DIMM up to 64GB | ||
| Video Card: | Intel® UHD Graphics; Support for discrete GTX1650Ti / 4G / RTX2060 6G / RTX3050Ti 8G | ||||
| Front Panel | Boot Button: | 1× Power Button | Extended Slot | WiFi Slot: | 1× M.2 2230 slot (WiFi / BT support) WiFi: 802.11 b/g/n/AC/AX Bluetooth 4.0 or above |
| USB Ports: | 2× USB 2.0 | SSD Slot: | 1× M.2 2280 slot (SATA / NVMe Gen3×4 support) 1× M.2 2280 slot (SATA or NVMe) |
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| Back Panel | Power Port: | 1× DC Jack 5.5×2.5mm (12–19V) | HDD: | 1× SATA HDD 2.5 inch (optional) | |
| Network Interface: | 1× RJ45 1000M (optional) | Dimensions: | 227 × 215 × 45mm | ||
| Display Interface: | 1× HDMI Out 1.4 (4K 30Hz) 1× HDMI Out 2.0 (4K 60Hz) 1× Type-C (4K 60Hz) |
Unit Weight: | Approx. 1300g | ||
| USB Ports: | 4× USB 3.2 Gen1 | Adapter: | 19V 180W | ||
| Audio Interface: | 1× 3.5mm Earphone / 1× 3.5mm MIC In | BIOS Support: | AMI UEFI BIOS, Support for PXE, WOL |
Equipped with NVIDIA RTX 3050 Ti (8GB GDDR6) independent graphics card, the graphics performance is improved by +220% compared with the previous generation, supporting DLSS 3.0 and the third-generation ray tracing core.
Dual vortex cooling system (patent ZL202310001.X) enables GPU 75W continuous performance release. Graphics card directly connected to CPU PCIe 4.0×8 channel — CUDA acceleration efficiency increased by 37%.
Metaverse content development (Unity real-time rendering stable at 60fps). 8K AI video enhancement — Topaz Video AI processing speed increased by 3×.
Using Intel i9-13900H processor (24 threads, 5.4GHz turbo frequency), through Intel Dynamic Tuning technology to achieve unmatched performance-per-watt.
Cinebench R23 multi-core score: 34,850 pts (41% higher than 12th gen). Heterogeneous scheduling engine: efficiency cores handle background tasks, performance cores focus on real-time computing.
High-frequency quantitative trading (Tick-level data processing delay < 8μs). Industrial digital twin — Ansys simulation speed increased by 55%.
World's thinnest 45mm body accommodates a full-size graphics card. Six-layer stacked motherboard design — signal loss reduced by 62%.
Liquid metal + heat spreader 3D heat conduction — full load noise < 25dBA. Dust filter quick-release design (IP5X certified) for high-dust environments.
