| Processor Specifications | CPU: | Intel i7-1270P / i7-1280-P 1340P 1360P ect. TDP: 28W Intel i7-12700H / i7-12900H 13700H 13900H ect. TDP: 45W |
Internal Storage | Memory Type: | DDR4 2133 - 3200 MHz or 2 * DDR5 4800MHz / 5200 MHz |
| CPU Terrace: | Intel 12th Generation or 13th CPU | Memory Slot: | 2*DDR4 SO-DIMM up to 64GB or 2*DDR5 SO-DIMM up to 96GB | ||
| Video Card: | Intel® Iris® Xe Graphics — Support for 4-display | ||||
| Front Panel | Boot Button: | 1×Power Button | Back Panel | Power Port: | 1×DC Jack 5.5×2.5mm (12–19V) |
| Thunderbolt: | 1×Thunderbolt 4 (compatible with PD power supply) | Network Interface: | 2×RJ45 2500M | ||
| USB Ports: | 4×USB 3.2 Gen1 | Display Interface: | 2×HDMI 2.0 4K 60Hz, 1×DP 1.4, 1×Type-C TB4 | ||
| Audio Interface: | 1×3.5mm Earphone / 1×3.5mm MIC In | USB Ports: | 2×USB 2.0 | ||
| Extended Slot | WiFi Slot: | M.2 2230 slot (WiFi/BT 4.0+ support) | Other Parameters | Dimensions: | 174×128×45mm |
| SSD Slot: | 1×M.2 2280 (SATA/NVMe Gen3), 1×M.2 2280 (NVMe Gen4) | Weight: | About 500g | ||
| HDD: | 1×SATA HDD 2.5-inch (optional) | Power Adapter: | 12V–19V 90W | ||
| BIOS: | AMI UEFI BIOS, PXE, WOL Support |
Dynamic TDP adjustment (28W–65W). Liquid metal heat conduction + carbon fiber air duct design, continuous load surface temperature ≤41℃ (noise 28dBA).
8K video real-time color grading (DaVinci Resolve). Industrial simulation calculation (MATLAB speed increased by 55%).
Single interface supports 40Gbps data transmission / 8K@60Hz output / 100W PD power supply. Compatible with external GPU docking station (RTX 6000 Ada) and PCIe capture card.
ECC memory check (optional) and asymmetric memory configuration support (32GB+64GB mixed insertion). 2.5-inch HDD includes a shock-absorbing frame (impact resistance 50G).
Four-screen output for production line monitoring and 3D modeling. Dual 2.5G network ports for physical OT/IT network isolation.
Thunderbolt 4 direct connection to CT equipment (DICOM 3.0). Antibacterial coating and medical EMC certification available.
Supports OpenVINO toolkit for 16-channel real-time video analysis. M.2 expansion for 5G modules with latency <15ms.
Hardware Transformation: Optional CAN bus/GPIO boards and wide-temperature cooling solutions (-40℃~85℃).
Management Suite: Intel vPro remote maintenance, TPM 2.0, and dual BIOS protection.
Compliance: IEC 61000-6-2 industrial EMC and MIL-STD-810H military specification resistance.